Abstract
This paper describes the distinction of ductile/brittle mode cutting by the spectrum analysis of AE signal in the vibration cutting of single crystal silicon. The brittle material like silicon has been required to be machined with the ductile mode. The vibration cutting is generally applied to this machining because the depth of cut with it is more than that with a usual continuous cutting. However, it is hard to keep the ductile mode cutting with even the vibration cutting. In this paper, we made it clear that the spectrum of 200-300 kHz in AE signal becomes pronounced when the cutting shifts to the brittle mode and acquired the ductile mode cutting in which the depth of cut was 6μm.
