Study of machining-induced subsurface damages by using Confocal Scanning Laser Microscope with a Raman Spectroscopy Interfa

Abstract

We have been developed the Ultra-Precision Lathe for lens dies without polishing. Ductile machining technology has not yet been widely used as the final finishing process for substrate. The most important problem is the subsurface damage generated during machining process, for example structure change, dislocation microcrack, and so on. The subsurface damage influences a mechanical, optical and electric performance of devices. Micro Raman spectroscopy is known as a powerful tool for a structure change and residual stress. In this forthcoming conference, we will report the depth profile of subsurface damage of the ductile-mode cutting Si wafer by using Raman spectroscopy in which a number of laser is used as an excitation source.