2011 JSPE Spring Conference
Session ID : E37
Conference information
Host: The Japan Society for Precision Engineering
Development of a porous chuck made by SiC (2 nd Report)
Experimental production and evaluation of a porous chuck for grinding and polishing a 450-mm wafer
*Shoko Yoshida, Seiichi Fukuoka, Kosuke Hirose, Atsunobu Une, Kenichiro Yoshitomi
Author information
Keywords:
Wafer chuck,
Ceramics,
Silicon Carbide,
Grinding and Polishing,
Mirror-polished wafer,
Vacuum contact
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