Proceedings of JSPE Semestrial Meeting
2013 JSPE Spring Conference
Session ID : J45
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Quantitative Evaluation of Chemical Action in Glass Polishing
*Tsutomu SawanoTakahiro MaruyamaYuu Moriwaki
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Abstract
Quantitative evaluation of chemical action has been studied using polishing pressure vs removal rate curves of glass polishing. In this paper, we introduce a new evaluation method and its application for several abrasives including our new cerium-free abrasive. By this method assuming that the deviation from Preston′s equation is due to chemical action, we obtained the proportion of various abrasive′s chemical action. These data reveal that chemical action mainly determines the removal rate, but mechanical action does not so much in glass polishing. And they also show our abrasive has almost the same characteristics as CeO2.
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© 2013 The Japan Society for Precision Engineering
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