Proceedings of JSPE Semestrial Meeting
2018 JSPE Spring Conference
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Improvement of copper dry etching characteristic of high-pressure hydrogen-based plasma by additive gases
*Hiromasa OhmiJumpei SatoYoshiki ShirasuHiroaki KakiuchiKiyoshi Yasutake
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Pages 623-624

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[in Japanese]
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© 2018 The Japan Society for Precision Engineering
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