抄録
The high-temperature joining process is a key technology for electronic components and assemblies of automotive and other high-temperature applications. Recently, focusing on a sintering behavior of metal particles, the joining process using metal particles has been proposed as a solder alternative to establish a new joining technology for high-temperature applications. In this study, microscale Ag particle pastes were experimentally applied and the effect of the addition of nanoscale particles into microscale particle pastes on Cu-to-Cu joint has been studied to improve the shear strength of Cu-to-Cu joint using a microscale particle paste. Then, the effect of bonding condition on the shear strength of Cu-to-Cu joint has been investigated. It was found that the shear strength of the joint using a 50/50 mixed paste was more than 20 MPa at 300 °C for 600 s under joining pressure of 5 MPa in air.
