抄録
Various study have been performed in order to relax residual stress and enhance bonding strength of bonded dissimilar materials. It is well-known that improvement of the interface shape is one of the most effective factors for achieving high bonding strength. To estimate the effect of interface shape on bonding strength, it is necessary to consider both theoretical thermal stress analysis and actual bonding strength of bonded dissimilar materials.
In this paper, the correlation between the order of stress singularity (λ power) and experimental bonding strength was investigated under a appropriate bonding temperature condition. The investigation was carried out with a cylindrical TiB2 -Ni joint by varying the interface edge angle. Actual bonding strength was evaluated by the tensile test, and the λ power was calculated by substituting secant stiffness moduli into Bogy's equation for each interface angle condition
From these results, the relationship between λ power and actual bonding strength was clarified, and the most desirable interface shape for achieving high strength joint was discussed. It was clarified that residual stress could be reduced and actual bonding strength increased by employing a desirable interface shape. The interface edge angle was related to the appropriate value of A and the highest bonding strength.
