抄録
The electroplating of copper using a gel electrolyte has been studied. The suitable condition to gelate the high concentration electrolyte solution by gelatin was found. Using the gel electrolyte, it is easy to fix and remove the electrolyte on/from the metal surface. The influences of pH and chloride concentration on copper deposition using gel electrolyte were investigated by the cathodic polarization curves and surface observation. Finally, pattern electroplating using gel electrolyte was performed.
