抄録
Important factors for fabricating thinner and more uniform films by electroless Ni-B plating using dimethylamine borane (DMAB) as the reducing agent were discussed. The number density of initial deposits was pointed out as the important factor for fabrication of thinner and more uniform films. Transmission electron microscope observations were performed for initial deposits plated from baths of different pH. The number density was lower in deposits plated from pH 9-10 than in those plated from pH 6-8. Dimethylamine produced through an oxidation reaction of a reducing agent (DMAB) prevents the initial deposition. Such a lower number density appeared in pH 9-10.
Nickel citrate - ammonia complex was formed under ammoniacal conditions. The nickel citrate - ammonia complex contributed to the increase in the number density of grains. It was possible to eliminate deposition prevention through the appropriate selection of nickel complexes. Results show that the initial deposition with higher number density of grains was achieved at all pH of Ni-B plating baths.
