スルファミン酸浴から形成したニッケル－マンガン電析合金めっきの物性評価

抄録

Electroplated nickel films have physical properties such as high hardness and low internal stress, which result from the inclusion of stress-reducing agents. However, sulfur inclusion causes brittleness when the plated films are exposed to a high-temperature environment. Nickel sulfide, which is formed when sulfur in a stress-reducing agent is included in plating, decreases the cohesive force of the crystal grains. This phenomenon, called sulfur brittleness, is an important difficulty related to electroplated nickel films. In the case of nickel electroforming for MEMS, the plating films must have low internal stress, high hardness, and high heat resistance without becoming brittle from sulfur inclusion. Many researchers have investigated nickel alloy plating as a way of suppressing this phenomenon. This study specifically assesses various properties of nickel manganese alloy plating. Results show the possibility of producing heat-resistant plated films while maintaining the required properties.