光触媒を用いたダイヤモンドのアミノ基修飾と銅基質に対する高分散複合化技術

抄録

We strove to produce a microdiamond（MD）- copper composite by electroplating. Unfortunately, copper is naturally non-wetting with MD because of their chemical incompatibility. We achieved modification of the amino group for the MD surface using a photocatalytic treatment, followed by electroplating of the copper. Results demonstrated that the MD - copper composite material assisted by photocatalysis markedly improved their interfacial affinity and thermal conductivity.