抄録
The wettability and the bonding strength of soft solders were studied. An electric furnace was used for heating to avoid the changes in the compositions of the solders by mixing with impurities.
The following results were obtained by experiments.
(1) The highest wettability of solders was given at 45-50% of tin content and at 40-50°C above the liquidus temperature.
(2) For obtaining high bonding strength, it was desirable that the soldering should be done as rapidly as possible and the soldered section should immediately be cooled. It was also observed that the bonding strength was higher with the increase in lead content; the reverse was the case with the tensile strength of the solder itself.
