抄録
The effect of the insertion of a Ti glue layers to enhance adhesion between Pt films and Ti oxide films has been investigated. Ti is known to be effective in adhesion enhancement, but the diffusion of Ti atoms into Pt films caused by heat treatment adversely affected bonding between the Pt films and Au wire. HRSEM and AES were used to analyze the behavior of the Ti atoms and it was found that excessive Ti atoms in the glue layer diffused onto the Pt surface. It was found that 5nm was the optimum thickness of the Ti glue layer in terms of both enhancing adhesion and suppressing deterioration of Au wire bonding.
