抄録
The deposition mechanism in palladium electroless plating from ethylenediamine complex solutions containing trimethylamine borane (TMAB) as a reducing agent was investigated.
The TMAB utilization factor was found to be 68% to 86% for palladium deposition and 25% to 32% for boron deposition. The deposition mechanism can be explained by the electrochemical mechanism, based on the following reactions.
Local anodic reaction
(CH3)3NBH3+2H2O→(CH3)3N+BO2-+7H+6e-
Local cathodic reaction
Pd2++2e-→Pd
mPd2++(CH3)3NBH3+(2m-3)e-→PdmB+(CH3)3N+3H+
