Section B
In situ Residual Stress Analysis in Thermosetting Resins for Semiconductor Packaging Substrate during Curing Process for Investigation of their Optimum Thermal Process
Midori Wakabayashi, Atsushi Izumi, Sakiko Suzuki, Toshiaki Watanabe, Hiroshi Nakaido
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2017 Volume 5 Issue 1 Pages 110-114
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