Section B
Analysis of Spatial Inhomogeneity of Residual Stress at Interface between Substrate Resins and Copper Foils in Semiconductor Packaging Substrates
Midori Wakabayashi, Atsushi Izumi, Sakiko Suzuki, Toshiaki Watanabe, Hiroshi Nakaido
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2017 Volume 5 Issue 1 Pages 115-118
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