IEICE Transactions on Electronics
Online ISSN : 1745-1353
Print ISSN : 0916-8524
Special Section on Fundamentals and Applications of Advanced Semiconductor Devices
Simulation of Temperature Distribution under Periodic Heating for Analysis of Thermal Diffusivity in Nanometer-Scale Thermoelectric Materials
Naomi YAMASHITAYuya OTAFaiz SALLEHMani NAVANEETHANMasaru SHIMOMURAKenji MURAKAMIHiroya IKEDA
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2018 Volume E101.C Issue 5 Pages 347-350

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Abstract

With the aim of characterizing the thermal conductivity for nanometer-scale thermoelectric materials, we have constructed a new measurement system based on ac calorimetry. Analysis of the obtained data requires time-evolution of temperature distribution in nanometer-scale material under periodic heating. In this study, we made a simulation using a C#-program for time-dependent temperature distribution, based on 2-dimensional heat-diffusion equation including the influence of heat emission from material edges. The simulation was applied to AlN with millimeter-scale dimensions for confirming the validity and accuracy. The simulated thermal diffusivity for 10×75-mm2-area AlN was 1.3×10-4 m2/s, which was larger than the value set in the heat-diffusion equation. This overestimation was also observed in the experiment. Therefore, our simulation can reproduce the unsteady heat conduction and be used for analyzing the ac calorimetry experiment.

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© 2018 The Institute of Electronics, Information and Communication Engineers
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