Recent Progress in the Development of Large-Capacity Integrated Silicon Photonics Transceivers

Abstract

We report our recent progress in silicon photonics integrated device technology targeting on-chip-level large-capacity optical interconnect applications. To realize high-capacity data transmission, we successfully developed on-package-type silicon photonics integrated transceivers and demonstrated simultaneous 400 Gbps operation. 56 Gbps pulse-amplitude-modulation (PAM) 4 and wavelength-division-multiplexing technologies were also introduced to enhance the transmission capacity.