抄録
We propose a gap-less optical interconnection between BGA package and board for practical on-board, chip-to-chip optical interconnection. The optical interconnect consists of polymer optical waveguides, an integral mirror on the PWB (printed wiring board), an optical via hole through package, and a connection structure and method requiring no alignment process. Optical waveguide, mirror, waveguide extensions and alignment studs were fabricated on the PWB as horizontal optical interconnect. Coaxial structured optical vias with core and cladding were formed through the package and with precise holes for alignment. Two packages were attached onto the PWB using standard BGA technology utilizing passive optical alignment. The optical characteristics and 10Gbit/s open-eye diagram were measured. A completely gap-less three dimensional optical interconnect between package-PWB-package was demonstrated.
