IEICE Transactions on Electronics
Online ISSN : 1745-1353
Print ISSN : 0916-8524
E92.C 巻, 2 号
選択された号の論文の17件中1~17を表示しています
Special Section on Recent Advances in Integrated Photonic Devices
  • Yuzo YOSHIKUNI
    2009 年E92.C 巻2 号 p. 185-186
    発行日: 2009/02/01
    公開日: 2009/02/01
    ジャーナル 認証あり
  • Ryoichi AKIMOTO, Guangwei CONG, Masanori NAGASE, Teruo MOZUME, Hidemi ...
    原稿種別: INVITED PAPER
    2009 年E92.C 巻2 号 p. 187-193
    発行日: 2009/02/01
    公開日: 2009/02/01
    ジャーナル 認証あり
    We demonstrated all-optical demultiplexing of 160-Gb/s signal to 40- and 80-Gb/s by a Mach-Zehnder Interferometric all-optical switch, where the picosecond cross-phase modulation (XPM) induced by intersubband excitation in InGaAs/AlAsSb coupled double quantum wells is utilized. A bi-directional pump configuration, i.e., two control pulses are injected from both sides of a waveguide chip simultaneously, increases a nonlinear phase shift twice in comparison with injection of single pump beam with forward- and backward direction. The bi-directional pump configuration is the effective way to avoid damaging waveguide facets in the case where high optical power of control pulse is necessary to be injected for optical gating at repetition rate of 40/80GHz. Bit error rate (BER) measurements on 40-Gb/s demultiplexed signal show that the power penalty is decreased slightly for the bi-directional pump case in the BER range less than ∼10-6. The power penalty is 1.3dB at BER of 10-9 for the bi-directional pump case, while it increases by 0.3-0.6dB for single pump cases. A power penalty is influenced mainly by signal attenuation at “off” state due to the insufficient nonlinear phase shift, upper limit of which is constrained by the current low XPM efficiency of ∼0.1rad/pJ and the damage threshold power of ∼100mW in a waveguide facet.
  • Atsuo MICHIUE, Takashi MIYOSHI, Tokuya KOZAKI, Tomoya YANAMOTO, Shin-i ...
    原稿種別: INVITED PAPER
    2009 年E92.C 巻2 号 p. 194-197
    発行日: 2009/02/01
    公開日: 2009/02/01
    ジャーナル 認証あり
    We fabricated high-power pure blue laser diodes (LDs) by using GaN-based material for full-color laser display. The operating output power, voltage and wall-plug efficiency of the LDs at forward current of 1.0A were 1.17W, 4.81V and 24.3%, respectively. The estimated lifetime of the LDs was over 30, 000 hours under continuous-wave operation.
  • Takeshi TAKEUCHI, Morio TAKAHASHI, Kouichi SUZUKI, Shinya WATANABE, Hi ...
    原稿種別: INVITED PAPER
    2009 年E92.C 巻2 号 p. 198-204
    発行日: 2009/02/01
    公開日: 2009/02/01
    ジャーナル 認証あり
    We have proposed a tunable laser with silica-waveguide ring resonators. In this tunable laser, a semiconductor optical amplifier was passively aligned and mounted onto a silica-waveguide substrate. The ring resonators can be tuned by controlling their temperatures using the thermo optic heaters formed on them, and there are no mechanically moving parts. Thus, they are sufficiently stable and reliable for practical use. Our tunable laser exhibits a high fiber-output power of more than 15dBm and a wide tunable range of 60nm (L-band, 50GHz spacing, 147 channels). Moreover, a tunable laser with a much wider tunable range of 96nm using 100-GHz-FSR ring resonators is also reported.
  • Nobuhiro KIKUCHI, Ken TSUZUKI, Takeshi KUROSAKI, Yasuo SHIBATA, Hirosh ...
    原稿種別: INVITED PAPER
    2009 年E92.C 巻2 号 p. 205-211
    発行日: 2009/02/01
    公開日: 2009/02/01
    ジャーナル 認証あり
    We present a dual traveling-wave electrode InP-based Mach-Zehnder (MZ) modulator with an n-i-n waveguide structure. An electrical input/output interface placed on one side of the chip helps us to drive the modulator in a push-pull configuration. This configuration provides the modulator with great advantages such as reduced driving voltage amplitude, chirp-free operation, and the ability to support advanced modulation formats. The fabricated modulator exhibits good performance. A 40Gb/s non-return-to-zero (NRZ) signal is successfully generated with a low driving of 1.3Vpp. In addition, a 10-Gb/s optical duobinary (DB) signal is successfully generated and transmitted over a 240-km single-mode fiber (SMF). We also developed a wavelength tunable transmitter hybrid integrated with a modulator with a wavelength tunable laser. Full C-band 10-Gb/s operation and a 100-km SMF transmission with a low power penalty are confirmed.
  • Hiroshi MURATA, Asuka TAKAHASHI, Yasuyuki OKAMURA
    原稿種別: PAPER
    2009 年E92.C 巻2 号 p. 212-216
    発行日: 2009/02/01
    公開日: 2009/02/01
    ジャーナル 認証あり
    A new LiTaO3 electro-optic polarization modulator utilizing traveling-wave electrodes and a double periodic poling structure is proposed. Utilizing the double periodic poling structure, both quasi-phase matching between TE and TM guided-modes, and quasi-velocity matching between a lightwave and a modulation microwave are obtainable at modulation frequencies over 10GHz.
  • Tao CHU, Hirohito YAMADA, Shigeru NAKAMURA, Masashige ISHIZAKA, Masato ...
    原稿種別: INVITED PAPER
    2009 年E92.C 巻2 号 p. 217-223
    発行日: 2009/02/01
    公開日: 2009/02/01
    ジャーナル 認証あり
    Silicon photonic devices based on silicon photonic wire waveguides are especially attractive devices, since they can be ultra-compact and low-power consumption. In this paper, we demonstrated various devices fabricated on silicon photonic wire waveguides. They included optical directional couplers, reconfigurable optical add/drop multiplexers, 1×2, 1×4, 1×8 and 4×4 optical switches, ring resonators. The characteristics of these devices show that silicon photonic wire waveguides offer promising platforms in constructing compact and power-saving photonic devices and systems.
  • Koichi MARU, Hisato UETSUKA
    原稿種別: INVITED PAPER
    2009 年E92.C 巻2 号 p. 224-230
    発行日: 2009/02/01
    公開日: 2009/02/01
    ジャーナル 認証あり
    This paper reviews our recent progress on arrayed waveguide gratings (AWGs) using super-high-Δ silica-based planar lightwave circuit (PLC) technology and their application to integrated optical devices. Factors affecting the chip size of AWGs and the impact of increasing relative index difference Δ on the chip size are investigated, and the fabrication result of a compact athermal AWG using 2.5%-Δ silica-based waveguides is presented. As an application of super-high-Δ AWGs to integrated devices, a flat-passband multi/demultiplexer consisting of an AWG and cascaded MZIs is presented.
  • Eiji HIGURASHI, Renshi SAWADA, Tadatomo SUGA
    原稿種別: INVITED PAPER
    2009 年E92.C 巻2 号 p. 231-238
    発行日: 2009/02/01
    公開日: 2009/02/01
    ジャーナル 認証あり
    This paper focuses on optical integration technology and its application in optical microsensors used in biomedical fields. The integration is based on the hybrid integration approach, achieving high performance, small size and weight, and lower cost. First, we describe the key technologies used in hybrid integration, namely passive alignment technology, low temperature bonding technology, and packaging technology for realizing advanced microsensors. Then, we describe an integrated laser Doppler flowmeter that can monitor blood flow in human skin.
  • Keiko ODA, Takahiro MATSUBARA, Kei-ichiro WATANABE, Kaori TANAKA, Mara ...
    原稿種別: PAPER
    2009 年E92.C 巻2 号 p. 239-246
    発行日: 2009/02/01
    公開日: 2009/02/01
    ジャーナル 認証あり
    We propose a gap-less optical interconnection between BGA package and board for practical on-board, chip-to-chip optical interconnection. The optical interconnect consists of polymer optical waveguides, an integral mirror on the PWB (printed wiring board), an optical via hole through package, and a connection structure and method requiring no alignment process. Optical waveguide, mirror, waveguide extensions and alignment studs were fabricated on the PWB as horizontal optical interconnect. Coaxial structured optical vias with core and cladding were formed through the package and with precise holes for alignment. Two packages were attached onto the PWB using standard BGA technology utilizing passive optical alignment. The optical characteristics and 10Gbit/s open-eye diagram were measured. A completely gap-less three dimensional optical interconnect between package-PWB-package was demonstrated.
  • Eiji HIGURASHI, Daisuke CHINO, Tadatomo SUGA
    原稿種別: PAPER
    2009 年E92.C 巻2 号 p. 247-251
    発行日: 2009/02/01
    公開日: 2009/02/01
    ジャーナル 認証あり
    An AuSn reflow process using hydrogen radicals as a way to avert the cleaning of flux residues was investigated for its application to solder bumping. AuSn particles (manufactured by a gas atomizer) smaller than 5µm, which are difficult to reflow by conventional methods that use rosin mildly activated (RMA) flux, were used for the experiments. In this process, the reduction effect by the hydrogen radicals removes the surface oxides of the AuSn particles. Excellent wetting between 1-µm-diameter AuSn particles and Ni metallization occurred in hydrogen plasma. Using hydrogen radicals, 100µm-diameter AuSn bumps without voids were successfully formed at a peak temperature of 300°C. The average bump shear strength was approximately 73gf/bump. Bump inspection after shear testing showed that a fracture had occurred between the Au/Ni/Cr under bump metallurgy (UBM) and Si substrate, suggesting sufficient wetting between the AuSn bump and the UBM.
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