Temperature-Aware Leakage Estimation Using Piecewise Linear Power Models

Abstract

Due to the superlinear dependence of leakage power consumption on temperature, and spatial variations in on-chip thermal profiles, methods of leakage power estimation that are known to be accurate require detailed knowledge of thermal profiles. Leakage power depends on the integrated circuit (IC) thermal profile and circuit design style. Here, we show that piecewise linear models can be used to permit accurate leakage estimation over the operating temperature ranges of the ICs. We then show that for typical IC packages and cooling structures, a given amount of heat introduced at any position in the active layer will have a similar impact on the average temperature of the layer. These two observations support the proof that, for wide ranges of design styles and operating temperatures, extremely fast, coarse-grained thermal models, combined with piecewise linear leakage power consumption models, enable the estimation of chip-wide leakage power consumption. These results are further confirmed through comparisons with leakage estimates based on detailed, time-consuming thermal analysis techniques. Experimental results indicate that, when compared with a leakage analysis technique that relies on accurate spatial temperature estimation, the proposed technique yields a 59,259× to 1,790,000× speedup in estimating leakage power consumption, while maintaining accuracy.