IEICE Transactions on Electronics
Online ISSN : 1745-1353
Print ISSN : 0916-8524
Special Section on Terahertz Waves Coming to the Real World
300-GHz Microstrip-to-Waveguide Transition on a Polyimide Substrate Integrated with an LTCC Substrate Integrated Waveguide
Takuro TAJIMAHo-Jin SONGMakoto YAITA
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2015 Volume E98.C Issue 12 Pages 1120-1127

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Abstract

A 300-GHz hetero-generous package solution with a combination of a polyimide microstrip-to-waveguide transition on low-temperature co-fired ceramic (LTCC) is presented. To assemble three parts — a metal back-short, polyimide transition, and LTCC substrate integrated waveguide (SIW) — a ridged microstructure beside the microstrip probe was implemented to reduce the air gap on the broadwall of a back-short. A back-to-back transition exhibited an insertion loss of 4.4 dB at 300 GHz and 49-GHz bandwidth with less than a 10-dB return loss. By evaluating loss of the microstrip line and SIW, we estimated the loss for a single transition, which was 0.9 dB at 300 GHz. The probe transition with ridged metal successfully suppressed the unwanted dip in transmission characteristics and eased the difficulty in assembly. The compact transition is easy to integrate in an antenna-in-package with an MMIC chip by combining suitable substrate materials for the transition and package.

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© 2015 The Institute of Electronics, Information and Communication Engineers
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