Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO

Junichiro KADOMOTO; So HASEGAWA; Yusuke KIUCHI; Atsutake KOSUGE; Tadahiro KURODA

doi:10.1587/transele.E99.C.659

IEICE Transactions on Electronics

Online ISSN : 1745-1353
Print ISSN : 0916-8524

Special Section on Analog Circuits and Related SoC Integration Technologies

Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO

Junichiro KADOMOTO, So HASEGAWA, Yusuke KIUCHI, Atsutake KOSUGE, Tadahiro KURODA

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Keywords: TCI, 3D integration, LC-VCO, EMI

JOURNAL RESTRICTED ACCESS

2016 Volume E99.C Issue 6 Pages 659-662

DOI https://doi.org/10.1587/transele.E99.C.659

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Abstract

This paper presents analysis and simple design guideline for ThruChip Interface (TCI) as located by LC-VCO which is used in high-speed SoC. The electromagnetic interference (EMI) from TCI channels to LC-VCO is analyzed and evaluated. The accuracy of the analysis and design guidelines is verified through the test-chip verification.

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