Toward realization of scalable packaging and wiring for large-scale superconducting quantum computers

Shuhei TAMATE; Yutaka TABUCHI; Yasunobu NAKAMURA

doi:10.1587/transele.2021SEP0007

IEICE Transactions on Electronics

Online ISSN : 1745-1353
Print ISSN : 0916-8524

This article has now been updated. Please use the final version.

Toward realization of scalable packaging and wiring for large-scale superconducting quantum computers

Shuhei TAMATE, Yutaka TABUCHI, Yasunobu NAKAMURA

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Keywords: superconducting qubit, sample packaging, three-dimensional wiring

JOURNAL FREE ACCESS Advance online publication

Article ID: 2021SEP0007

DOI https://doi.org/10.1587/transele.2021SEP0007

The final version of this article is now available: Vol. E105.C (2022), No. 6 pp. 290-295

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Abstract

In this paper, we review the basic components of superconducting quantum computers. We mainly focus on the packaging and wiring technologies required to realize large-scalable superconducting quantum computers.

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