論文ID: 2024CTI0002
Radio frequency (RF) integrated circuits for wireless applications began evolving in the 1990s, with the second generation of mobile phones as the primary application. The wireless local area network (WLAN), which began in the 2000s, and the fourth-generation mobile phone (smart phone), which began in the 2010s, have greatly expanded the transmission volume.
The fifth generation of cell phones, which began in the 2020s, expanded the adaptive band to the millimeter wave band. The 6th generation mobile phones, which are expected to start in the 2030s, will continue to evolve to higher frequency bands, including sub-THz, for further expansion of transmission capacity. After the 4th generation, the application is not only for mobile phones but also for the IoT and other applications. Therefore, the required characteristics are also diverse, including broadband high-capacity transmission and narrow bandwidth low power consumption. This paper describes the evolution of integrated circuits for wireless applications, focusing on data communications, especially on high-capacity applications.