IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
Online ISSN : 1745-1337
Print ISSN : 0916-8508
Special Section on Selected Papers from the 20th Workshop on Circuits and Systems in Karuizawa
A Novel Expression of Spatial Correlation by a Random Curved Surface Model and Its Application to LSI Design
Shin-ichi OHKAWAHiroo MASUDAYasuaki INOUE
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2008 Volume E91.A Issue 4 Pages 1062-1070


We have proposed a random curved surface model as a new mathematical concept which enables the expression of spatial correlation. The model gives us an appropriate methodology to deal with the systematic components of device variation in an LSI chip. The key idea of the model is the fitting of a polynomial to an array of Gaussian random numbers. The curved surface is expressed by a new extension from the Legendre polynomials to form two-dimensional formulas. The formulas were proven to be suitable to express the spatial correlation with reasonable computational complexity. In this paper, we show that this approach is useful in analyzing characteristics of device variation of actual chips by using experimental data.

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© 2008 The Institute of Electronics, Information and Communication Engineers
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