特集「三次元積層集積デバイスによる半導体集積回路技術の進展と展望」
三次元積層のための接合技術
2019 年 62 巻 11 号 p. 672-675
詳細
2019 年 62 巻 11 号 p. 672-675
3D integration is one of the most important technologies for developing new-generation electronics devices.
In this article, bonding technologies, key factor of 3D integration are introduced. In particular, fusion bonding method and direct bonding method have the potential for wafer level bonding.
