Vacuum and Surface Science
Online ISSN : 2433-5843
Print ISSN : 2433-5835
Special Feature : Film Deposition by Controlling Plasma-induced Surface Reactions
Thin-film Silicon Growth by Plasma-enhanced CVD : Gas-phase, Surface and In-film Reactions for High-quality Film Formation
Shota NUNOMURA Michio KONDO
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2024 Volume 67 Issue 2 Pages 44-51

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Abstract

We overview plasma-enhanced chemical vaper deposition (PECVD) of high-quality thin-film silicon. In PECVD, such a film is grown by the deposition of precursors, which is generated by the gas-phase reactions of source gases in plasma. The growth of the film depends on the surface reactions of precursors and the reactions in the growing film, i.e., in-film reactions, which influences the film structure and properties. The in-film reactions also take place after the growth, i.e., post-growth annealing. So, the reactions should be properly controlled throughout the growth and annealing for the high-quality film formation. Here, the growth kinetics and related reactions are presented for device-grade hydrogenated amorphous silicon (a-Si:H) films.

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この記事はクリエイティブ・コモンズ [表示 - 非営利 4.0 国際]ライセンスの下に提供されています。
https://creativecommons.org/licenses/by-nc/4.0/deed.ja
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