Vacuum and Surface Science
Online ISSN : 2433-5843
Print ISSN : 2433-5835
Special Feature : Process and Integrated Technologies supporting Advanced 2-nm Generation Semiconductor Devices
Chiplet Packaging Technology for the 2 nm-Generation Advanced Semiconductor
Katsuya KIKUCHI
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Keywords: chiplet packaging technology, 2-nm generation advanced semiconductor, bonding, TSV
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2025 Volume 68 Issue 12 Pages 676-681

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Abstract

Chiplet packaging technology is one of the important integration technologies for 2-nm generation advanced semiconductors. In this article, bonding and TSV (through silicon via) technologies, which are key factors of chiplet packaging technology for 2-nm generation advanced semiconductors are introduced.

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この記事はクリエイティブ・コモンズ [表示 - 非営利 4.0 国際]ライセンスの下に提供されています。
https://creativecommons.org/licenses/by-nc/4.0/deed.ja
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