Zairyo-to-Kankyo
Online ISSN : 1881-9664
Print ISSN : 0917-0480
ISSN-L : 0917-0480
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Volume 72, Issue 10
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Commentary
Research Paper
  • Film Deposition Behavior of Phosphorus Copper Tubes during Stress Corrosion Cracking
    Takahito Nakajima, Hiroshi Tanimura, Kazuhiro Fukami, Kuniaki Murase
    2023 Volume 72 Issue 10 Pages 259-268
    Published: October 10, 2023
    Released on J-STAGE: December 01, 2023
    DOIhttps://doi.org/10.3323/jcorr.72.259
    JOURNAL FREE ACCESS
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    The deposition behavior of films, corrosion products, during SCC on a phosphorus copper tube in an ammonia solution was investigated. It was found that Cu(OH)2 deposited on the tube surface and Cu2O deposited in the intergranular corrosion pit. The electrochemical behavior of the copper tube during SCC test indicated that pH in the intergranular corrosion pit is lower than that near the surface due to dissolution of phosphorus. Considering these environments, the difference of the deposited film type was explained by thermodynamics. It was also presumed that the Cu2O deposited thickly at the tip of the corrosion pit became the source of stress, leading to the occurrence of cracking.

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