Transactions of The Japan Institute of Electronics Packaging

Transactions of The Japan Institute of Electronics Packaging

Published by The Japan Institute of Electronics Packaging

282 registered articles
(updated on March 07, 2026)

Online ISSN : 1884-8028
Print ISSN : 1883-3365
ISSN-L : 1883-3365

JOURNAL PEER REVIEWED FREE ACCESS

Reducing Electrical Resistivity of Copper-CNT Composite Film for High-Ampacity Back End of Line and Interconnection Yujiro Takeishi, Kiyokazu Yasuda
Etching Process Analysis of Galvanic Corrosion Inhibition Etching Solution Using Quartz Crystal Microbalance Method Sachio Yoshihara

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Most viewed articles (February 2026)

1

Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform

Released on J-STAGE: April 25, 2022 | Volume 15 Pages E21-012-1-E21-012-13

Koichi Takemura, Daisuke Ohshima, Akihiro Noriki, Daisuke Okamoto, Akio Ukita, Jun Ushida, Masatoshi Tokushima, Takanori Shimizu, Ichiro Ogura, Daisuke Shimura, Tsuyoshi Aoki, Takeru Amano, Takahiro Nakamura
2

Novel Thin Copper Transfer Films for Fine Line Formation on PCB Substrates

Released on J-STAGE: April 21, 2011 | Volume 3 Pages 86-90

Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota
3

Surface Modification of Polyethylene Terephthalate (PET) by 172-nm Excimer Lamp

Released on J-STAGE: May 13, 2013 | Volume 5 Pages 47-54

Takashi Kasahara, Shuichi Shoji, Jun Mizuno
4

Fine Trace Substrate with 2 μm Fine Line for Advanced Package

Released on J-STAGE: March 25, 2016 | Volume 8 Pages 18-22

Dyi-Chung Hu, Puru Lin, Yu Hua Chen
5

UV Laser Releasable Temporary Bonding Materials for FO-WLP

Released on J-STAGE: January 30, 2019 | Volume 11 Pages E18-004-1-E18-004-7

Hikaru Mizuno, Hiroyuki Ishii, Hitoshi Kato, Takashi Mori, Hiroki Ishikawa, Yooichiroh Maruyama, Kenzo Ohkita, Koichi Hasegawa

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