Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform

Released on J-STAGE: April 25, 2022 | Volume 15 Pages E21-012-1-E21-012-13

Koichi Takemura, Daisuke Ohshima, Akihiro Noriki, Daisuke Okamoto, Akio Ukita, Jun Ushida, Masatoshi Tokushima, Takanori Shimizu, Ichiro Ogura, Daisuke Shimura, Tsuyoshi Aoki, Takeru Amano, Takahiro Nakamura

Novel Thin Copper Transfer Films for Fine Line Formation on PCB Substrates

Released on J-STAGE: April 21, 2011 | Volume 3 Pages 86-90

Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota

Heat Dissipation Measurement of Electronic Component on PCB by Means of External Heater and Heat Flux Sensor

Released on J-STAGE: November 30, 2021 | Volume 14 Pages E21-003-1-E21-003-10

Zidi Li, Joao Vitor Thomsen Silveira, Kazuyoshi Fushinobu, Hiroki Nagamizo, Ryuta Yasui, Takuya Shinoda

Development of Lift-off Photoresists with Unique Bottom Profile

Released on J-STAGE: March 25, 2016 | Volume 8 Pages 62-67

Hirokazu Ito, Kouichi Hasegawa, Tomohiro Matsuki, Shiro Kusumoto

Surface Morphology and Characteristics of Electroplated Au/Ni Films for Connector Contact Materials

Released on J-STAGE: June 20, 2014 | Volume 6 Pages 18-23

Yoshiyuki Nishimura, Mariko Maebara, Katsuhiko Tashiro, Hideo Honma, Tsugito Yamashita