Transactions of The Japan Institute of Electronics Packaging

Transactions of The Japan Institute of Electronics Packaging

Published by The Japan Institute of Electronics Packaging

278 registered articles
(updated on November 04, 2025)

Online ISSN : 1884-8028
Print ISSN : 1883-3365
ISSN-L : 1883-3365

JOURNAL PEER REVIEWED FREE ACCESS

Design and Feasibility of Modular Design for the Electro-Optical Waveguide for Customization and Fabrication Improvement Titinai Chinggungval, Hideki Yokoi
Enhanced High-Temperature Performance of SiC Power Devices Using Ni-Al Composite Paste and Ag Wire Bonding for Electric Vehicle Applications Xing Wei, Yasunori Tanaka, Junko Takahashi, Norihiro Murakawa, Kohei Tatsumi
Low-temperature Cooking Using Dielectric Heating at 50 Hz AC Voltage and Pasteurization Effect Kei Imai, Yuuki Furuyama, Kouji Kuramochi, Takahiko Yamamoto
Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder Alloys Jiye Zhou, Xin F. Tan, Stuart D. McDonald, Keith Sweatman, Tetsuya Akaiwa, Tetsuro Nishimura, Kazuhiro Nogita

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Most viewed articles (October 2025)

1

Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform

Released on J-STAGE: April 25, 2022 | Volume 15 Pages E21-012-1-E21-012-13

Koichi Takemura, Daisuke Ohshima, Akihiro Noriki, Daisuke Okamoto, Akio Ukita, Jun Ushida, Masatoshi Tokushima, Takanori Shimizu, Ichiro Ogura, Daisuke Shimura, Tsuyoshi Aoki, Takeru Amano, Takahiro Nakamura
2

UV Laser Releasable Temporary Bonding Materials for FO-WLP

Released on J-STAGE: January 30, 2019 | Volume 11 Pages E18-004-1-E18-004-7

Hikaru Mizuno, Hiroyuki Ishii, Hitoshi Kato, Takashi Mori, Hiroki Ishikawa, Yooichiroh Maruyama, Kenzo Ohkita, Koichi Hasegawa
3

Novel Thin Copper Transfer Films for Fine Line Formation on PCB Substrates

Released on J-STAGE: April 21, 2011 | Volume 3 Pages 86-90

Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota
4

Technology and Trend Analysis on High Thermally Conductive Resin-Based Materials for the Future Semiconductor Systems

Released on J-STAGE: January 06, 2023 | Volume 15 Pages E21-015-1-E21-015-16

Yukihiro Kanechika, Kazuya Okamoto
5

Low Dk/Df Polyimide Adhesives for Low Transmission Loss Substrates

Released on J-STAGE: April 20, 2018 | Volume 11 Pages E17-006-1-E17-006-7

Takashi Tasaki, Atsushi Shiotani, Takashi Yamaguchi, Keisuke Sugimoto

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