Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform

Released on J-STAGE: April 25, 2022 | Volume 15 Pages E21-012-1-E21-012-13

Koichi Takemura, Daisuke Ohshima, Akihiro Noriki, Daisuke Okamoto, Akio Ukita, Jun Ushida, Masatoshi Tokushima, Takanori Shimizu, Ichiro Ogura, Daisuke Shimura, Tsuyoshi Aoki, Takeru Amano, Takahiro Nakamura

UV Laser Releasable Temporary Bonding Materials for FO-WLP

Released on J-STAGE: January 30, 2019 | Volume 11 Pages E18-004-1-E18-004-7

Hikaru Mizuno, Hiroyuki Ishii, Hitoshi Kato, Takashi Mori, Hiroki Ishikawa, Yooichiroh Maruyama, Kenzo Ohkita, Koichi Hasegawa

Novel Thin Copper Transfer Films for Fine Line Formation on PCB Substrates

Released on J-STAGE: April 21, 2011 | Volume 3 Pages 86-90

Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota

Development of a Curable Conductive Copper Paste in Air

Released on J-STAGE: March 25, 2016 | Volume 8 Pages 151-155

Masashi Kajita, Tomoyuki Takahashi, Akemi Kano, Toshiyuki Sato

Heat Dissipation Measurement of Electronic Component on PCB by Means of External Heater and Heat Flux Sensor

Released on J-STAGE: November 30, 2021 | Volume 14 Pages E21-003-1-E21-003-10

Zidi Li, Joao Vitor Thomsen Silveira, Kazuyoshi Fushinobu, Hiroki Nagamizo, Ryuta Yasui, Takuya Shinoda