Transactions of The Japan Institute of Electronics Packaging

Transactions of The Japan Institute of Electronics Packaging

Published by The Japan Institute of Electronics Packaging

280 registered articles
(updated on January 04, 2026)

Online ISSN : 1884-8028
Print ISSN : 1883-3365
ISSN-L : 1883-3365

JOURNAL PEER REVIEWED FREE ACCESS

Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder Alloys Jiye Zhou, Xin F. Tan, Stuart D. McDonald, Keith Sweatman, Tetsuya Akaiwa, Tetsuro Nishimura, Kazuhiro Nogita
Indoor Spatial Coordinate Determination in Multi-Story Buildings Using 5G and Sensors: Demonstration Using a Compact Detection Module Maho Terashima, Nobuaki Hashimoto
Low-temperature Cooking Using Dielectric Heating at 50 Hz AC Voltage and Pasteurization Effect Kei Imai, Yuuki Furuyama, Kouji Kuramochi, Takahiko Yamamoto
Power Cycling Test Using Positive and Negative Gate-Voltage Switching Circuit for SiC-MOSFET Power Module Takashi Ando, Fumiki Kato, Junji Senzaki, Hiroshi Sato

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Most viewed articles (December 2025)

1

Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform

Released on J-STAGE: April 25, 2022 | Volume 15 Pages E21-012-1-E21-012-13

Koichi Takemura, Daisuke Ohshima, Akihiro Noriki, Daisuke Okamoto, Akio Ukita, Jun Ushida, Masatoshi Tokushima, Takanori Shimizu, Ichiro Ogura, Daisuke Shimura, Tsuyoshi Aoki, Takeru Amano, Takahiro Nakamura
2

Technology and Trend Analysis on High Thermally Conductive Resin-Based Materials for the Future Semiconductor Systems

Released on J-STAGE: January 06, 2023 | Volume 15 Pages E21-015-1-E21-015-16

Yukihiro Kanechika, Kazuya Okamoto
3

Evaluation on Mechanical Properties of Sn-Bi-Ag Solder and Reliability of the Solder Joint

Released on J-STAGE: March 25, 2016 | Volume 8 Pages 46-54

Hanae Shimokawa, Tasao Soga, Koji Serizawa, Kaoru Katayama, Ikuo Shohji
4

Micro Structure Observation and Reliability Behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps

Released on J-STAGE: March 07, 2012 | Volume 4 Pages 73-86

Yasumitsu Orii, Kazushige Toriyama, Sayuri Kohara, Hirokazu Noma, Keishi Okamoto, Daisuke Toyoshima, Keisuke Uenishi
5

Novel Thin Copper Transfer Films for Fine Line Formation on PCB Substrates

Released on J-STAGE: April 21, 2011 | Volume 3 Pages 86-90

Hirohisa Narahashi, Shigeo Nakamura, Tadahiko Yokota

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