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Mikio MURAOKA, Shinji KOMATSU
Article type: Article
Session ID: 203
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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We present a method for characterizing ultrathin films using sensitivity-enhanced atomic force acoustic microscopy, where a concentrated-mass cantilever having a flat tip was used as a sensitive oscillator. Evaluation was aimed at 6-nm-thick and 10-nm-thick diamond-like carbon (DLC) films deposited, using different methods, on a hard disk for the effective Young's modulus defined as E/ (1-v^2), where E is the Young's modulus and v is the Poisson's ratio. The resonant frequency of the cantilever was affected not only by the film's elasticity but also by the substrate even at an indentation depth of about 0.6nm. The substrate effect was removed by employing a theoretical formula on the indentation of a layered half-space, together with a hard disk without DLC coating. The moduli of the 6-nm-thick and 10-nm-thick DLC films were 392 GPa and 345 GPa, respectively. The error analysis showed the standard deviation less than 5% in the moduli.
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Kohji MINOSHIMA, Kazuto TANAKA, Yusuke ISHIGAKI
Article type: Article
Session ID: 204
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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High-strength steels are sensitive to an environment, and in particular hydrogen embrittlement (HE) is an important issue to overcome. In this investigation, nanoindentation tests were performed in a high-strength steel, JIS SCM435: some samples were cathodically hydrogen charged, and the influence of hydrogen on the nanoscopic deformation behavior was investigated. When the applied load was higher than 3mN, no influence of cathodic charging was observed. However, when the applied load was smaller than 1mN, calculated average hardness values became higher in a cathodically charged sample than in a non-charged sample.
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Daisuke KATAGIRI, Shigeru HAMADA, Shuichi TANI
Article type: Article
Session ID: 205
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Toyomitsu HARADA, Hiroshi NOGUCHI
Article type: Article
Session ID: 206
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Koichi KAIZU, Kiyohiko IKEDA
Article type: Article
Session ID: 207
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Shouzi YAMAZAKI, Kenji IIMURA, Michitaka Suzuki, Mitsuaki HIROTA
Article type: Article
Session ID: 208
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Mami NAGATAKE, Nobutaka ITOH, Makoto SAKAIRI, Masakazu MEGURO, Daisuke ...
Article type: Article
Session ID: 209
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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As for the PWB of a portable product, it tends to become high density wiring and thinly. The warp of the PWB causes to unjoint and the bridge of the solder joint in the reflow process. This time, authors design the simple evaluation substrate, and shadow moire technique measurement and the numerical simulation for the temperature profile of the reflow are executed. Temperature dependent material properties are measured, and They are used for the simulation. Then, Authors reports the correlation of the simulation result and the measured value. The warp forecast of the substrate by the simulation become possible.
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Takayuki SUGIMOTO, Shin-ichi KOMAZAKI
Article type: Article
Session ID: 210
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Toshiro MATSUMOTO, Masataka TANAKA, Guzik ARTUR
Article type: Article
Session ID: 211
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Eiji Nakamachi, Yasutomo Uetsuji, Takayuki Maeda
Article type: Article
Session ID: 212
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Shigetoshi ARAKI, Akio SUGIMOTO
Article type: Article
Session ID: 213
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Macroscopic loss factors are derived for a sea-island type of polymer alloy containing many ellipsoidal island-particles whose semi-axes are different from each other by using the equivalent inclusion method combined with the Mori-Tanaka theorem. In the analysis, Eshelby tensor for the particle is rearranged in the form of a function of Poisson's ratio of the matrix multiplied by the geometrical factor which is a function of the only aspect ratios of particle. Consequently, three macroscopic loss factors can be expressed by the geometrical factor successfully.
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Seiji FUJINO
Article type: Article
Session ID: 214
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Diagonal Relaxed Robust Incomplete Cholesky Conjugate Gradient method is based on the idea of accelerated stabilization by diagonal entries. Through numerical experiments for realistic problems, we show that the proposed preconditioned CG method insures convergence rates.
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Hisashi NAKAMOTO, Toshinori YOKOMAKU
Article type: Article
Session ID: 215
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Kazuto TANAKA, Kohji MINOSHIMA, Takehiro IMOTO, Yohei OGINO, Susumu SH ...
Article type: Article
Session ID: 216
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Mechanical properties of thin polysilicon microelements were evaluated by using the nano mechanical test system. The in-situ image observed by the indenter probe helps to position it within sub-micrometers of the desired test location. The Young's modulus obtained by bending tests with a help of FEM analysis was 145GPa To analyze the effect of the crystal orientations on the Youngs modulus, three-dimensional finite element model was developed using a Voronoi structure. The crystal orientation of the film was analyzed by means of an electron back-scattering diffraction pattern (EBSP) method The front surface of the film had no oriented structure. Therefore, random crystal orientation was given to each grain of the FEM model. Young's modulus obtained by this FEM analysis was 161GPa.
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Yuichi TADANO, Mitsutoshi KURODA, Hirohisa NOGUCHI
Article type: Article
Session ID: 217
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Tomohiro TAKAKI, Yoshihiro TOMITA
Article type: Article
Session ID: 218
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Akira KATO, Rie FUNATANI, Norihiro SAKAI
Article type: Article
Session ID: 219
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Kenji Machida
Article type: Article
Session ID: 220
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Satoru YONEYAMA, Akikazu KITAGAWA, Kazuhiko TANI, Setsuo IWATA, Hisao ...
Article type: Article
Session ID: 221
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Shinya ABE, Izuru NISHIKAWA
Article type: Article
Session ID: 222
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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A high order Digital Image Correlation Method (DCM) was developed to measure a strain distribution at notch root with a high accuracy. Only a uniform deformation in a subset was considered in the conventional DCM system. However, the strain distribution near the stress concentrated area, like a notch, is not linear. For the application, a new technique on the strain distribution expression in a subset was incorporated into the conventional DCM system. From the measurement result, the developed DCM system was found to be effective to measure the strain in the vicinity of notch root. This system was applied to evaluate the stress intensity factor of the cracked member.
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Motoharu FUJIGAKI, Toshiyuki KITA, Toru MATUI, Yoshiharu MORIMOTO, Ter ...
Article type: Article
Session ID: 223
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Eiji AZECHI, Izuru NISHIKAWA, Shunsuke MORIOKA
Article type: Article
Session ID: 224
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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This paper describes the development of an improved speckle strain/displacement gage technique (SSDG). A new measurement technique under the condition of both an arbitrary incident angle of laser beam and an arbitrary measurement angle of CCD camera are needed to monitor various surface strains and displacements. The influence of an irradiation angle and a measurement angle on the in-plane measurement has already studied in the previous paper. In this study, an application to the out-of-plane measurement was developed.
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Shuichi ARIKAWA, Kensuke ICHINOSE, Kenji GOMI
Article type: Article
Session ID: 225
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Hirohisa KIMACHI, Takumi INAGAKI, Yuichi FUJITA, Kaori SHIRAKIHARA, No ...
Article type: Article
Session ID: 226
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Michinari FUTAMURA, Syun FUKUZAWA, Takushi MIYAKE, Nobutada OHNO
Article type: Article
Session ID: 227
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Hironobu YUKI, Shiguma IIJIMA, Takayuki SUZUKI
Article type: Article
Session ID: 228
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Yuki SASAKI, Shigeru KUROSAKI
Article type: Article
Session ID: 229
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Hiroyuki TADA, Naoya TADA, Ichiro SHIMIZU, Keigo KANAMURA
Article type: Article
Session ID: 230
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Hirotsugu INOUE, Daisuke ITO, Kikuo KISHIMOTO
Article type: Article
Session ID: 231
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Kenichi SAKAUE, Masahisa TAKASHI
Article type: Article
Session ID: 232
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Kazuo ARAKAWA, Yasuyuki MORITA, Mitsugu TODO
Article type: Article
Session ID: 233
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Moire interferometry technique was adopted to analyze the thermal deformations of four kinds of flip-chip devices mounted on FR-4 substrate and multi-layer substrate, with and without underfill. A thermal loading was applied by heating the devices from room temperature to an elevated temperature. The experimental results showed that the underfill gave similar curvatures of silicon chip and the substrate. In the flip-chip devices mounted on the multi-layer substrate, thermal expansion coefficient mismatch between the chip and substrate was reduced, and bending deformations were decreased. The deformation of solder balls in the underfilled flip-chip device mounted on the multi-layer substrate was the least in the four kinds of flip-chip devices. The thermal deformations of Stacked-MCP (Multi Chip Package) were also measured by phase-shifting moire interferometry. Digital image processing was introduced to determine the deformations with a sensitivity of nanometer scale.
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Koji FUKUOKA, Ichiro SHIMIZU, Naoya TADA
Article type: Article
Session ID: 234
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Naoya NISHIMURA, Toshio HATTORI, Minoru YAMASHITA, Naoyuki HAYAKAWA, K ...
Article type: Article
Session ID: 235
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Kiyotaka SAKINO, Masahiro HORITA
Article type: Article
Session ID: 236
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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In order to evaluate the strain rate sensitivity of dynamic flow stress of aluminum alloy at very high strain rates, constant strain rate tests and strain rate reduction tests are conducted for 2017-T4 in the strain rate range from about 1×10^3s^<-1> to 3×10^4s^<-1>. The flow stress increases steeply above about 1.5×10^4s^<-1>. The behavior is interpreted on the basis of a simplified model which can represent a transition in the rate controlling mechanism of dislocation motion from a thermally activated process to a viscous drag.
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Takashi YOKOYAMA, Kenji NAKAI, Takafumi ODAMURA
Article type: Article
Session ID: 237
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Ryo Kuroda, Mitsugu Todo, Kazuo Arakawa, Ken Goto
Article type: Article
Session ID: 238
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Kazuya IWANAGA, Shinichi SUZUKI
Article type: Article
Session ID: 239
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Satoshi Fujino, Tomoaki Tsuji
Article type: Article
Session ID: 240
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Article type: Appendix
Pages
App5-
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Sumio TANAKA, Akihide SAMOTO, Hironobu NISHITANI
Article type: Article
Session ID: 301
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Takahiro TERANISHI, Hironobu NISITANI
Article type: Article
Session ID: 302
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Nobuhiro YOSHIKAWA, Yoshihiko HANGAI, Sergey V. DMITRIEV, Masanori KOH ...
Article type: Article
Session ID: 303
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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A limitation of empirical methodology on strength evaluation seems highlighted in problems of metal/ceramics interface fracture. This study is a trial to remove the limitation by means of computational science based on the atomistic simulation. A sort of multiscale simulation is successfully organized starting from ab initio to determine interatomic potentials for interface and concluding at quasicontinuum simulation to extend atomistic region. A simulation-based strength evaluation is proposed through numerical experiments related with fracture originated by interface crack. Inelastic phenomena associated with fracture are described in terms of their contribution to total potential energy.
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Yoshiyuki KAJI, Yukio MIWA, Takashi TSUKADA
Article type: Article
Session ID: 304
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Yuji ANDO
Article type: Article
Session ID: 305
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Yukitaka MURAKAMI
Article type: Article
Session ID: 306
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Yoru WADA
Article type: Article
Session ID: 307
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Tetsuo SOSHIRODA, Masao KINEFUCHI, Masaaki MIURA
Article type: Article
Session ID: 308
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Hisashi Hirukawa, Yoshiyuki Furuya, Saburo Matsuoka, Shiro Torizuka, H ...
Article type: Article
Session ID: 309
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Nobuo NAGASHIMA, Saburo MATSUOKA
Article type: Article
Session ID: 310
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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Masahiro GOTO, Terutoshi YAKUSHIJI, Seung-Zeon HAN, Takaei YAMAMOTO
Article type: Article
Session ID: 311
Published: November 03, 2005
Released on J-STAGE: August 01, 2017
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