Spinning Effect of Barreling Plating on Physical Properties and Electrochemical Behavior of Copper Layers

抄録

Barreling methods are suitable for small pieces. Electroplating aluminum (Al) using copper (Cu) is less costly than using a bar of Cu as a small part. Cu barreling electroplating was conducted on an Al alloy. Various rotating speeds were applied during the plating process. Barreling plating of the Cu onto Al alloy substrates was performed in 0.5 M CuSO₄ with 40 mA cm⁻² of current density for 2 h. Scanning electron microscopy-energy dispersive spectroscopy, a MATLAB software, X-ray diffraction, and potentiostat were used to investigate the properties of the Cu layer. In addition, the deposition rate, current efficiency, and thickness were examined. By increasing the barrel rotating speed, the deposition rate, cathodic current efficiency, thickness, roughness, and crystallite size were all reduced. The sample without rotation has a deposition rate, cathodic current efficiency, and average layer thickness of 32.49 µm h⁻¹, 92.08%, and 74.32 µm, respectively. The specimen was made using a barrelling speed of 50 rpm, which shows a more compact morphology, a more positive open circuit potential, and a lower corrosion rate.