報文
電気めっき法による硫酸浴からのSn-Cuはんだバンプの作製
2003 年 71 巻 9 号 p. 791-794
詳細
2003 年 71 巻 9 号 p. 791-794
The purpose of this investigation was to form Sn-Cu solder bumps for flip-chip bonding from acid sulfate bath (2M H2SO4+0.2M SnSO4+0.008 M CuSO4) containing N,N-bis(polyoxyethylene)octadecylamine (POOA-10) using electroplating method. Compact and relatively smooth Sn-Cu alloy electrodeposits were obtained from acid sulfate baths containing POOA-10. Cu contents in electrodeposits were approximately constant in the range of current densities from 1.0 to 7.0 A/dm2. The solidus temperature of Sn-Cu alloy electrodeposits was 227℃. Sn-Cu alloy bumps of straightwall and mushroom types with homogeneous composition were obtained from acid sulfate baths containing POOA-10 under galvanostatic condition.
