抄録
Multi-core 3D IC is a new solution for greater quantity of cores, but with critical challenge of internal thermal. The interlayer cooling system is introduced for this problem, and expends the design space of task allocation. This work proposes a thermal optimal task allocation algorithm for multi-core 3D IC with interlayer cooling system, integrated with simulated annealing method. The results show that the maximal temperature and temperature gradient reduced by 19.4 °C and 5.1 °C respectively, compared to the randomized policy, and obtain better balance between normal and extreme cases than traditional ranking policy, in a design of 3 active device layers.
