A single phase modulation for pulse-based inductive-coupling connection in 3D stacked chip

Abstract

This paper proposes an efficient modulation in high-speed inter-chip data communication with inductive-coupling wireless connection for 3D-stacked system in package (SiP). In this modulation, signal is generated only in one polarity of the digital signal transmission. Compared with BPM and NRZ modulation, it has a 50% power reduction and better crosstalk immunity.