IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543
LETTER
A single phase modulation for pulse-based inductive-coupling connection in 3D stacked chip
Li ZhangXiaowei XuDawei LiXiaofei ChenXuecheng Zou
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2017 Volume 14 Issue 20 Pages 20170874

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Abstract

This paper proposes an efficient modulation in high-speed inter-chip data communication with inductive-coupling wireless connection for 3D-stacked system in package (SiP). In this modulation, signal is generated only in one polarity of the digital signal transmission. Compared with BPM and NRZ modulation, it has a 50% power reduction and better crosstalk immunity.

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© 2017 by The Institute of Electronics, Information and Communication Engineers
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