A single phase modulation for pulse-based inductive-coupling connection in 3D stacked chip

Li Zhang; Xiaowei Xu; Dawei Li; Xiaofei Chen; Xuecheng Zou

doi:10.1587/elex.14.20170874

This article has now been updated. Please use the final version.

A single phase modulation for pulse-based inductive-coupling connection in 3D stacked chip

Li Zhang, Xiaowei Xu, Dawei Li, Xiaofei Chen, Xuecheng Zou

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Keywords: inductive-coupling, wireless connection, 3D package, modulation

JOURNAL FREE ACCESS Advance online publication

Article ID: 14.20170874

DOI https://doi.org/10.1587/elex.14.20170874

The final version of this article is now available: Vol. 14 (2017), No. 20 pp. 20170874-20170874

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Abstract

This paper proposes an efficient modulation in high-speed inter-chip data communication with inductive-coupling wireless connection for 3D-stacked system in package (SiP). In this modulation, signal is generated only in one polarity of the digital signal transmission. Compared with BPM and NRZ modulation, it has a 50% power reduction and better crosstalk immunity.

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