Thermal-aware task mapping for communication energy minimization on 3D NoC

抄録

Three dimensional Network-on-chip (3D NoC) is regarded as an attractive architecture delivering high communication performance. However, due to its high power density and strong vertical thermal correlation, thermal issues in 3D NoC are critical. In this paper, we propose a thermal-aware task mapping algorithm (3D-TTM) to reduce peak temperature meanwhile minimize the communication energy consumption. Experimental results show that the proposed scheme can achieve significant peak temperature reduction (up to 5.75 K) when compared to other methods. Moreover, our proposed algorithm achieves up to 63.34% communication energy consumption reduction.