2018 Volume 15 Issue 12 Pages 20180160
Pre-bond TSV test plays a vital role in improving the yield and reducing the cost of 3D ICs. In this paper, we proposed an effective test structure and flow for pre-bond TSV test. In the test structure, the resistor-capacitor parameter related to a specific TSV can be reflected by oscillations with high accuracy. By analyzing the period variations between two oscillations generated in successive test steps, the proposed test scheme enables quick detection of faulty TSVs. Experimental results have demonstrated the effectiveness of the proposed pre-bond TSV test scheme.