A high-pass filter based on through-silicon via (TSV)

Abstract

A fourth-order high-pass filter is proposed, which is formed by spiral inductors and TSV capacitors. The components of this filter rely on the TSV technology, which is generally regarded as vertical interconnection but now used to compose capacitor. The comparison of the results between finite element method and equivalent electric circuit obviously proves that they have nearly equal filtering characteristics including cut-off frequency and roll-drop rate. Moreover, the comparisons are made among the HPFs based on different technologies, and the challenges the proposed HPF faces are discussed.