Investigation on impact of substrate on low-pass filter based on coaxial TSV

Abstract

An ultra-compact Butterworth low-pass filter (LPF) has been proposed based on through-silicon-via (TSV) technology without investigation the substrate impact. The conductivity of substrate generally leads to noise interference on the passive devices. This letter analyzes the substrate impact on the components, i.e. the inductor and capacitor, and on the whole LPF, by establishing and studying the equivalent circuit model. It is concluded that this type of LPF based on coaxial TSV can be widely used for any-resistivity substrate.