IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543
LETTER
Thermal effect on dynamic Ron degradation of p-GaN AlGaN/GaN HEMTs on SiC substrates
Manqing HuGengxin LiuE DuFeiyan Mu
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2020 Volume 17 Issue 17 Pages 20200255

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Abstract

In this work, the thermal effect in the dynamic on-resistance (Ron) degradation of normally-off p-GaN AlGaN/GaN HEMTs on SiC substrates has been analyzed using pulse-mode voltage stress. Compare to the significant degradation characteristics of GaN-on-Si HEMTs, a suppressed dynamic Ron degradation is achieved in GaN-on-SiC due to higher thermal boundary conduction with less ionized acceptor-like buffer traps. Different electrical characteristics have been discussed to reveal the traps mechanisms related to thermal effect. Finally, two-dimension device simulation has been carried out to probe the physical insight into the thermal effect on the dynamic Ron degradation.

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© 2020 by The Institute of Electronics, Information and Communication Engineers
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