TSV-based hairpin bandpass filter for 6G mobile communication applications

Abstract

Aimed at sixth-generation (6G) mobile communication applications, three fifth-order novel ultra-compact hairpin bandpass filter is proposed. Through-Silicon Via (TSV), a three-dimensional integration technology, is used to implement the arms of hairpin units, and some hairpin units consist of four arms. In this letter, the design method of the three proposed filters is introduced, and the filtering characteristics are verified by HFSS, an industry-grade simulator based on finite element method. The results reveal that the three proposed filter has the center frequency of 0.405THz, 0.3915THz, and 0.3955THz with bandwidth of 0.1THz, 0.077THz, and 0.063THz and exhibits an insertion loss of 2.0dB and return loss over 12.4dB, 13.4dB, and 14dB. The size of the three proposed filters is both 0.284 × 0.0325mm² (1.29 × 0.148λ_g²).