Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package

抄録

Due to the advantages of good thermal and electrical performance, lower cost, greater design flexibility, fan-out wafer-level package (FOWLP) has been widely used in millimeter-wave applications. In this letter, a fan-out wafer-level package with the size of 12mm×12mm for the millimeter-wave applications is accomplished by the redistribution layer first (RDL-First) process. The double-sided multiple redistribution layers (RDLs) are used to fan out the signals and to form the antenna-in-package (AiP). An antenna integration scheme for the Ultra Short Range automotive Radar (USRR) chips with four transmit and receive channels was achieved. In addition, a 1×3 series fed aperture-coupled antenna array in the fan-out area was designed. Correspondingly, a probe based antenna measurement setup for FOWLP-AiP working in E band was carried out. The measurement results are in good agreement with the simulation.