2024 年 21 巻 2 号 p. 20230543
This paper aims to achieve miniaturization of a broadband high-performance microwave component through SIP integrated technology. The circuit design adopts a wide instantaneous bandwidth frequency conversion scheme and sufficient heat dissipation design to ensure the performance and stability. The design of microwave components has 4 GHz instantaneous wideband with the operating frequency band covering Ku band. The system in a package (SIP) receiver includes three layers with independent circuit units. Each layer of circuit is composed of chips, ceramic substrate, and metal block. Each layer of the circuit is designed to be air-tight through a metal cover plate. The structure bearing, signal interconnection and heat conduction of the upper circuit are realized through ball grid array (BGA). The X-ray photos demonstrate that this 3D stacked structure has good and uniform linking characteristics, improving the robustness of the components. The temperature test results show that the temperature remained stable under 45°C after 10 minutes, indicating the efficient heat dissipation design of the device. The test results show that the noise figure is less than 7.0dB, spur and harmonic is less than -50dBm, power consumption is 5.7W, channel phase stability within 4GHz is less than 5°, and switching response time is 45ns.