Effect of blending poly(2,6-dimethyl-1,4-phenylene sulfide) resin bearing vinyl groups on printed wiring boards

Abstract

To reduce transmission loss in printed wiring boards (PWBs), materials with low dielectric loss tangent, such as oligo(2,6-dimethyl-1,4-phenylene ether)-based resins, are commonly used. In this study, we fabricated PWBs blending poly(2,6-dimethyl-1,4-phenylene sulfide)-based resins (PMPS-V), in which benzene rings are connected via sulfide rather than ether bonds, and evaluated its effects. The PWBs exhibited a low loss tangent of 0.0017 and achieved UL94 V-0 flame retardancy with only one-third the conventional flame retardant content. Transmission loss and eye diagram degradation up to 30 GHz were effectively suppressed after heat testing at 150°C. It was clarified that PMPS-V contributes to improving the thermal reliability of PWBs.