IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543
An optimized QFP structure for use in radio frequency multi-chip module applications
Haiyan SUNZhikuang CAIJianhui WULongxing SHI
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2012 Volume 9 Issue 21 Pages 1666-1674

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Abstract

This paper presents the design and demonstration of an optimized quad flat pack (QFP) structure for radio frequency (RF) multi-chip module (MCM) application. In order to reduce large impedance discontinuities in the low-cost QFP, a new design scheme with cascade coplanar transmission line structure built into the lead frame has been developed. The optimized structure is accurately modeled in 3D model by utilizing ANSYS HFSS. S-parameter is utilized to help in understanding the contributing to the optimized QFP structure. The analysis results indicate that the optimized QFP structure can be fully capable of supporting 5.8GHz RF MCM application.

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© 2012 by The Institute of Electronics, Information and Communication Engineers
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