抄録
This paper presents the design and demonstration of an optimized quad flat pack (QFP) structure for radio frequency (RF) multi-chip module (MCM) application. In order to reduce large impedance discontinuities in the low-cost QFP, a new design scheme with cascade coplanar transmission line structure built into the lead frame has been developed. The optimized structure is accurately modeled in 3D model by utilizing ANSYS HFSS. S-parameter is utilized to help in understanding the contributing to the optimized QFP structure. The analysis results indicate that the optimized QFP structure can be fully capable of supporting 5.8GHz RF MCM application.
