Impact of ground solder ball failure in BGA package on near electric field radiation

Yidong Yuan; Tianmeng Zhang; Ziren Wang; Kaixuan Song; Lingyu Bi; Lu Tian; Jinchun Gao

doi:10.1587/elex.19.20220313

This article has now been updated. Please use the final version.

Impact of ground solder ball failure in BGA package on near electric field radiation

Yidong Yuan, Tianmeng Zhang, Ziren Wang, Kaixuan Song, Lingyu Bi, Lu Tian, Jinchun Gao

Author information

Yidong Yuan
Beijing Smart-chip Microelectronics Technology Co., Ltd
Tianmeng Zhang
Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications
Ziren Wang
China Telecommunication Technology, China Academy of Information and Communications Technology
Kaixuan Song
Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications
Lingyu Bi
Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications
Lu Tian
Beijing Smart-chip Microelectronics Technology Co., Ltd
Jinchun Gao
Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications

Keywords: BGA package, near electric field radiation, connection failure

JOURNAL FREE ACCESS Advance online publication

Article ID: 19.20220313

DOI https://doi.org/10.1587/elex.19.20220313

The final version of this article is now available: Vol. 19 (2022), No. 17 pp. 20220313-20220313

Details

Abstract

In this paper, the impact of ground solder ball failure in ball grid array (BGA) package on near electric field radiation was investigated from the perspectives of both theoretical modelling and experimental testing. Based on the structural and material parameters, a 3D electromagnetic field numerical calculation model of circuit boards with failed ground solder balls was developed. The influences of both different number of failed ground solder balls and different signal frequencies on near electric field radiation was calculated. The electromagnetic field model results are validated using experimental tests.

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