電子部品プリント基板面認識のための画像処理検査アルゴリズム

抄録

This paper proposes an image processing method to enforce the quality control of the molded electronic devices on the PC environment in the real production line. It was known that the cost of this inspection system could be expected below the real tact time and the specified running cost. Since the plastic mold of the electronic devices is likely to be distorted and to suffer from the defects called “bari"(in Japanese) which is a kind of tiny chip attached at the wedge of the mold, several degradations of the quality will be increased in the fabrication process. If such defects could not be detected in advance, for example, the fabrication of the electric terminals to the mold can not be successful at the end of the process. The proposed algorithm was implemented on the general purpose PC in the real production line and was proved to be practical by means of more than 6,000,000 device inspections in 6 month.